Invention Grant
- Patent Title: Packaging buffer material
- Patent Title (中): 包装缓冲材料
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Application No.: US11865149Application Date: 2007-10-01
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Publication No.: US07754310B2Publication Date: 2010-07-13
- Inventor: Sheng-Hsi Kuo
- Applicant: Sheng-Hsi Kuo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2007-005470 20070717
- Main IPC: B65D81/133
- IPC: B65D81/133

Abstract:
A packaging buffer material includes a pair of outer sidewalls having concave grooves in a length direction, and bottom wall having a concave groove in the length direction, and stoppers, preventing a packing object from being displaced, attached between the sidewalls. If external pressure is applied to the packaging buffer material, the outer sidewalls and concave groove bottoms are deformed. However, because of narrow widths of the concave grooves, the outer sidewalls are not entirely deformed but only the concave grooves are deformed. Due to this, a space can be kept between the sidewalls even if high external pressure is applied to the packaging buffer material.
Public/Granted literature
- US20090022914A1 PACKAGING BUFFER MATERIAL Public/Granted day:2009-01-22
Information query
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