Invention Grant
US07754327B2 Absorbent articles comprising a radiation cured hot melt positioning adhesive
有权
包含辐射固化的热熔胶定位粘合剂的吸收制品
- Patent Title: Absorbent articles comprising a radiation cured hot melt positioning adhesive
- Patent Title (中): 包含辐射固化的热熔胶定位粘合剂的吸收制品
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Application No.: US11432007Application Date: 2006-05-11
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Publication No.: US07754327B2Publication Date: 2010-07-13
- Inventor: Wei Kong
- Applicant: Wei Kong
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski
- Main IPC: B32B7/12
- IPC: B32B7/12 ; C08F2/50
Abstract:
An article comprising an adhesive attachment region is provided. The adhesive attachment region comprises a radiation curable hot melt pressure sensitive adhesive.
Public/Granted literature
- US20070264497A1 Absorbent articles comprising a radiation cured hot melt positioning adhesive Public/Granted day:2007-11-15
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