An interconnect system including: a separator plate to provide an anode gas flow space; a first metal interconnect disposed between the separator plate and an anode surface; a nickel oxide paste applied in a pattern over the surface of the anode and adjacent surface of the separator plate which when sintered results in a first conductive layer bonded to the anode and the first interconnect, and a second conductive layer bonded to the first interconnect and the separator plate; a second metal interconnect disposed between a cathode surface of the cell and the separator plate of an adjacent cell cassette; and a silver-containing paste applied over the surface of the cathode and the separator plate which when sintered results in a third conductive layer bonded to the cathode and the second interconnect, and a fourth conductive layer bonded to the second interconnect and the separator plate.