Invention Grant
- Patent Title: Methods of forming and using reticles
- Patent Title (中): 形成和使用掩模版的方法
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Application No.: US11750165Application Date: 2007-05-17
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Publication No.: US07754395B2Publication Date: 2010-07-13
- Inventor: William Stanton , Gurtej S. Sandhu
- Applicant: William Stanton , Gurtej S. Sandhu
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: G03F1/00
- IPC: G03F1/00

Abstract:
Some embodiments include methods of treating reticles to provide backside masking across regions of the reticle to compensate for problems occurring during photolithographic processing. The problems may be, for example, defects in the reticle, problems associated with deposition or development of photoresist, or problems associated with substrate topography. The masking may alter one or both of transmission of electromagnetic radiation through the masked regions, and polarization of electromagnetic radiation passed through the masked regions. Some embodiments include reticles having patterns along front sides for patterning electric magnetic radiation, and masks across portions of the backsides to at least partially block transmission of electromagnetic radiation through portions of the patterns.
Public/Granted literature
- US20080286699A1 Reticles, and methods of treating reticles, configuring reticles and using reticles Public/Granted day:2008-11-20
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