Invention Grant
- Patent Title: Method for manufacturing a surface and integrated circuit using variable shaped beam lithography
- Patent Title (中): 使用可变形光束光刻制造表面和集成电路的方法
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Application No.: US12473241Application Date: 2009-05-27
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Publication No.: US07754401B2Publication Date: 2010-07-13
- Inventor: Akira Fujimura , Lance Glasser
- Applicant: Akira Fujimura , Lance Glasser
- Applicant Address: US CA San Jose
- Assignee: D2S, Inc.
- Current Assignee: D2S, Inc.
- Current Assignee Address: US CA San Jose
- Agency: The Mueller Law Office, P.C.
- Main IPC: G03F9/00
- IPC: G03F9/00

Abstract:
A method is disclosed in which a plurality of variable shaped beam (VSB) shots is used to form a desired pattern on a surface. Shots within the plurality of shots are allowed to overlap each other. Dosages of the shots may also be allowed to vary. The union of the plurality of shots may deviate from the desired pattern. The plurality of shots may be determined such that a pattern on the surface calculated from the plurality of shots is within a predetermined tolerance of the desired pattern. In some embodiments, an optimization technique may be used to minimize shot count. In other embodiments, the plurality of shots may be optionally selected from one or more pre-computed VSB shots or groups of VSB shots. The method of the present disclosure may be used, for example, in the process of manufacturing an integrated circuit by optical lithography using a reticle, or in the process of manufacturing an integrated circuit using direct write.
Public/Granted literature
- US20100055578A1 Method for Manufacturing a Surface and Integrated Circuit Using Variable Shaped Beam Lithography Public/Granted day:2010-03-04
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