Invention Grant
- Patent Title: Method of making a light emitting element
- Patent Title (中): 制造发光元件的方法
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Application No.: US11892258Application Date: 2007-08-21
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Publication No.: US07754514B2Publication Date: 2010-07-13
- Inventor: Takayoshi Yajima , Masanobu Ando , Toshiya Uemura , Akira Kojima , Koji Kaga
- Applicant: Takayoshi Yajima , Masanobu Ando , Toshiya Uemura , Akira Kojima , Koji Kaga
- Applicant Address: JP Nishikasugai-gun, Aichi-gun
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Nishikasugai-gun, Aichi-gun
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2006-225671 20060822; JP2007-185421 20070717; JP2007-206865 20070808
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of making a light emitting element, the light emitting element with a semiconductor layer represented by: AlXInYGa1−X−YN (0≦X≦1, 0≦Y≦1, 0≦X+Y≦1), has the step of wet-etching a surface of the semiconductor layer by using an etching solution to have a roughened surface on the semiconductor layer. The wet-etching is conducted without irradiating the surface of the semiconductor layer with a light with a wavelength region corresponding to energy higher than bandgap energy of the semiconductor layer.
Public/Granted literature
- US20080254562A1 Method of making a light emitting element Public/Granted day:2008-10-16
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