Invention Grant
US07754532B2 High density chip packages, methods of forming, and systems including same
失效
高密度芯片封装，成型方法和包括其的系统
- Patent Title: High density chip packages, methods of forming, and systems including same
- Patent Title (中): 高密度芯片封装，成型方法和包括其的系统
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Application No.: US11583411Application Date: 2006-10-19
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Publication No.: US07754532B2Publication Date: 2010-07-13
- Inventor: Paul A. Farrar
- Applicant: Paul A. Farrar
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
Methods and devices for multi-chip stacks are shown. A method is shown that assembles multiple chips into stacks by stacking wafers prior to dicing into individual chips. Methods shown provide removal of defective chips and their replacement during the assembly process to improve manufacturing yield.
Public/Granted literature
- US20080096320A1 High density chip packages, methods of forming, and systems including same Public/Granted day:2008-04-24
Information query
IPC分类:
