Invention Grant
US07754576B2 Method of forming inside rough and outside smooth HSG electrodes and capacitor structure
失效
粗糙和外部平滑HSG电极和电容器结构内部形成方法
- Patent Title: Method of forming inside rough and outside smooth HSG electrodes and capacitor structure
- Patent Title (中): 粗糙和外部平滑HSG电极和电容器结构内部形成方法
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Application No.: US12326458Application Date: 2008-12-02
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Publication No.: US07754576B2Publication Date: 2010-07-13
- Inventor: Lingyi A. Zheng
- Applicant: Lingyi A. Zheng
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Whyte Hirschboeck Dudek SC
- Main IPC: H01L21/8242
- IPC: H01L21/8242 ; H01L21/20

Abstract:
A container capacitor and method of forming the container capacitor are provided. The container capacitor comprises a lower electrode fabricated by forming a layer of doped polysilicon within a container in an insulative layer disposed on a substrate; forming a barrier layer over the polysilicon layer within the container; removing the insulative layer to expose the polysilicon layer outside the container; nitridizing the exposed polysilicon layer at a low temperature, preferably by remote plasma nitridation; removing the barrier layer to expose the inner surface of the polysilicon layer within the container; and forming HSG polysilicon over the inner surface of the polysilicon layer. The capacitor can be completed by forming a dielectric layer over the lower electrode, and an upper electrode over the dielectric layer. The cup-shaped bottom electrode formed within the container defines an interior surface comprising HSG polysilicon, and an exterior surface comprising smooth polysilicon.
Public/Granted literature
- US20090075448A1 Method of Forming Inside Rough and Outside Smooth HSG Electrodes and Capacitor Structure Public/Granted day:2009-03-19
Information query
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