Invention Grant
US07754597B2 Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
失效
接合垫制造方法，用于制造接合焊盘的方法和电子设备以及电子设备
- Patent Title: Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
- Patent Title (中): 接合垫制造方法，用于制造接合焊盘的方法和电子设备以及电子设备
-
Application No.: US11457505Application Date: 2006-07-14
-
Publication No.: US07754597B2Publication Date: 2010-07-13
- Inventor: Naoyuki Toyoda
- Applicant: Naoyuki Toyoda
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2005-216881 20050727
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/31 ; H01L21/469
Abstract:
A method for fabricating a bonding pad 45 includes disposing a droplet L including a liquid containing a conductive material on a substrate P by a droplet ejection method and solidifying the disposed droplet L to forms the pad. The bonding pad 45 formed has a cylindrical shape and includes a concave part 47.
Public/Granted literature
Information query
IPC分类:
