Invention Grant
- Patent Title: Chemical mechanical polishing process
- Patent Title (中): 化学机械抛光工艺
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Application No.: US11364482Application Date: 2006-02-28
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Publication No.: US07754611B2Publication Date: 2010-07-13
- Inventor: Chun Fu Chen , Yung Tal Hung , Yun Chi Yang
- Applicant: Chun Fu Chen , Yung Tal Hung , Yun Chi Yang
- Applicant Address: TW
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW
- Agency: Baker & McKenzie LLP
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
A chemical mechanical polishing method is disclosed. The method includes forming a film on a wafer having at least one trench structure thereon; polishing the surface of the film by providing a polishing composition to provide a first polished surface; rinsing the first polished surface with a rinse composition to provide a rinsed surface; and polishing the rinsed surface by providing a second polishing composition to provide a second polished surface.
Public/Granted literature
- US20070202702A1 Chemical mechanical polishing process Public/Granted day:2007-08-30
Information query
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