Invention Grant
US07754618B2 Method of forming an apparatus having a dielectric containing cerium oxide and aluminum oxide
失效
形成具有含有氧化铈和氧化铝的电介质的装置的方法
- Patent Title: Method of forming an apparatus having a dielectric containing cerium oxide and aluminum oxide
- Patent Title (中): 形成具有含有氧化铈和氧化铝的电介质的装置的方法
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Application No.: US12117361Application Date: 2008-05-08
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Publication No.: US07754618B2Publication Date: 2010-07-13
- Inventor: Kie Y. Ahn , Leonard Forbes
- Applicant: Kie Y. Ahn , Leonard Forbes
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461

Abstract:
A dielectric layer including cerium oxide and aluminum oxide acting as a single dielectric layer, and a method of fabricating such a dielectric layer, produces a reliable structure with a high dielectric constant (high-k) for use in a variety of electronic devices. Such a dielectric layer including cerium oxide and aluminum oxide may be used as the gate insulator of a MOSFET, as a capacitor dielectric in a DRAM, as a tunnel gate insulator in flash memory, or as a dielectric in an NROM device, among others, because the high dielectric constant (high-k) of the film provides the functionality of a much thinner silicon dioxide film.
Public/Granted literature
- US20080248618A1 ATOMIC LAYER DEPOSITION OF CeO2/Al2O3 FILMS AS GATE DIELECTRICS Public/Granted day:2008-10-09
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