Invention Grant
US07754790B2 Adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloylethyl) hydrogen phosphate
有权
环氧丙烯酸酯，非饱和树脂和双（甲基丙烯酰基乙基）磷酸氢盐的粘合剂
- Patent Title: Adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloylethyl) hydrogen phosphate
- Patent Title (中): 环氧丙烯酸酯，非饱和树脂和双（甲基丙烯酰基乙基）磷酸氢盐的粘合剂
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Application No.: US12010172Application Date: 2008-01-22
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Publication No.: US07754790B2Publication Date: 2010-07-13
- Inventor: Masao Saito , Osamu Takamatsu , Takayuku Matsushima
- Applicant: Masao Saito , Osamu Takamatsu , Takayuku Matsushima
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP11-228101 19990812
- Main IPC: B32B7/10
- IPC: B32B7/10 ; C08K9/02 ; C08L63/10
Abstract:
An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
Public/Granted literature
- US20080157030A1 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same Public/Granted day:2008-07-03
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