A high frequency electronic part comprising a conductor wiring for transmitting an electric signal of 100 MHz to 100 GHz, and an insulation layer composed of a void containing thermoplastic resin film orientated in at least one direction by stretching. The void containing thermoplastic resin film contains voids in the range between 3% and 45% by volume, the number of voids in a thickness direction of the film is 5 or more, and a ratio of the number of voids to film thickness defined by the following equation is in the range between 0.1 and 10 voids/μm:ratio of the number of voids to film thickness (voids/μm)=the number of voids (voids) in film thickness direction/film thickness (μm).