A structure with a multilayer plated through hole is disclosed. At least one dielectric layer formed by deposition and a conductive layer are formed in an original plated through hole (PTH). The dielectric layer partially covers wiring layers of the substrate to electrically isolate the PTH and the conductive layer to form a multilayer PTH so as to save PTH occupation space of the substrate. Preferably, the formation of the dielectric layer is electrophoretic deposition to control the deposition thickness in the PTH very even and thin, no drilling is necessary. Accordingly, it can increase electrical performance and decrease cross-talk effect.