Invention Grant
US07754997B2 Apparatus and method to confine plasma and reduce flow resistance in a plasma
失效
限制等离子体并降低等离子体反应器中的流动阻力的装置和方法
- Patent Title: Apparatus and method to confine plasma and reduce flow resistance in a plasma
- Patent Title (中): 限制等离子体并降低等离子体反应器中的流动阻力的装置和方法
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Application No.: US11924086Application Date: 2007-10-25
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Publication No.: US07754997B2Publication Date: 2010-07-13
- Inventor: Kallol Bera , Yan Ye , James D. Carducci , Daniel J. Hoffman , Steven C. Shannon , Douglas A. Buchberger, Jr.
- Applicant: Kallol Bera , Yan Ye , James D. Carducci , Daniel J. Hoffman , Steven C. Shannon , Douglas A. Buchberger, Jr.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Pattersib & Sheridan, LLP
- Main IPC: B23K9/00
- IPC: B23K9/00
Abstract:
An apparatus configured to confine a plasma within a processing region in a plasma processing chamber. In one embodiment, the apparatus includes a ring that has a baffle having a plurality of slots and a plurality of fingers. Each slot is configured to have a width less than the thickness of a plasma sheath contained in the processing region.
Public/Granted literature
- US20080105660A1 APPARATUS AND METHOD TO CONFINE PLASMA AND REDUCE FLOW RESISTANCE IN A PLASMA REACTOR Public/Granted day:2008-05-08
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