Invention Grant
- Patent Title: Method for forming quantum dot, and quantum semiconductor device and method for fabricating the same
- Patent Title (中): 用于形成量子点的方法和量子半导体器件及其制造方法
-
Application No.: US11976967Application Date: 2007-10-30
-
Publication No.: US07755080B2Publication Date: 2010-07-13
- Inventor: Hai-Zhi Song , Toshio Ohshima
- Applicant: Hai-Zhi Song , Toshio Ohshima
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2002-147287 20020522; JP2003-034245 20030212
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
The method for forming a quantum dot according to the present invention comprises the step of forming an oxide in a dot-shape on the surface of a semiconductor substrate 10, the step of removing the oxide to form a concavity 16 in the position from which the oxide has been removed, and the step of growing a semiconductor layer 18 on the semiconductor substrate with the concavity formed in to form a quantum dot 20 of the semiconductor layer in the concavity. The concavity is formed in the semiconductor substrate by forming the oxide dot in the surface of the semiconductor substrate and removing the oxide, whereby the concavity can be formed precisely in a prescribed position and in a prescribed size. The quantum dot is grown in such a concavity, whereby the quantum dot can have good quality and can be formed in a prescribed position and in a prescribed size.
Public/Granted literature
- US20080067498A1 Method for forming quantum dot, and quantum semiconductor device and method for fabricating the same Public/Granted day:2008-03-20
Information query
IPC分类: