Invention Grant
- Patent Title: Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device
- Patent Title (中): 半导体发光元件，照明模块，照明装置，显示元件及半导体发光元件的制造方法
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Application No.: US10580929Application Date: 2004-12-17
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Publication No.: US07755095B2Publication Date: 2010-07-13
- Inventor: Hideo Nagai
- Applicant: Hideo Nagai
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Priority: JP2003-428258 20031224
- International Application: PCT/JP2004/019457 WO 20041217
- International Announcement: WO2005/062389 WO 20050707
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L29/74 ; A01K7/00
Abstract:
In an LED array chip (2), LEDs (6) are connected together in series by a bridging wire (30) The LEDs (6) each have a semiconductor multilayer structure (8-18) including a light emitting layer (14) Here, the semiconductor multilayer structure (8-18) is epitaxially grown on a front surface of an SiC substrate (4) A phosphor film (48) covers the LEDs (6) Two power supply terminals (36 and 38), which are electrically independent from each other, are formed on a back surface of the SiC substrate (4) The power supply terminal (36) is connected to a cathode electrode (32) of an LED (6a) at a lower potential end by a bridging wire (40) and a plated-through hole (42) The power supply terminal (38) is connected to an anode electrode (34) of an LED (6d) at a higher potential end by a bridging wire (44) and a plated-through hole (46).
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