Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
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Application No.: US12146292Application Date: 2008-06-25
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Publication No.: US07755099B2Publication Date: 2010-07-13
- Inventor: Yong Seok Choi
- Applicant: Yong Seok Choi
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2007-0063771 20070627
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
Provided is a light emitting device package. The light emitting device package comprises a base substrate, a frame, and a light emitting device. The base substrate comprises a plurality of electrode pads. The frame is formed of silicon, attached on the base substrate, and has an opening. The light emitting device is electrically connected to the electrode pad in the opening.
Public/Granted literature
- US20090001405A1 LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-01-01
Information query
IPC分类:
