Invention Grant
- Patent Title: Flexible lead surface-mount semiconductor package
- Patent Title (中): 柔性引线表面贴装半导体封装
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Application No.: US10404793Application Date: 2003-04-02
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Publication No.: US07755199B2Publication Date: 2010-07-13
- Inventor: Jiahn-Chang Wu
- Applicant: Jiahn-Chang Wu
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A diode chip is mounted on two bottom metal leads of a surface-mount package through two flexible links. The links are zigzag cantilevers attached to the metallic plates. The cantilevers serve as springs to support the device and to cushion any temperature stress or bending stress so as not to damage the connection between the device and the metallic leads.
Public/Granted literature
- US20030201542A1 Flexible lead surface-mount semiconductor package Public/Granted day:2003-10-30
Information query
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