A printed circuit board includes a multiple-layer electrical circuit board and a nickel arm, wherein the nickel arm has an unconnected end located opposite to the connected end of the nickel arm, wherein the nickel arm has a front side and a backside located opposite to the front side of the nickel arm, wherein the backside of the nickel arm is located adjacent to the multiple layer electrical circuit board. A dimple is formed at the unconnected end of the nickel arm and on the front side of the nickel arm. An air gap is formed between the backside of the arm and the multiple layer electrical circuit board, wherein the air gap permits the arm to flex within the air gap. A lead zirconium titanate element is laminated to the printed circuit board, wherein the dimple on the front side of the arm contacts a surface of the lead zirconium titanate element, wherein a restoring spring force of the nickel arm maintains electrical contactivity between the dimple and the lead zirconium titanate element.