An exemplary method for examining bonding resistance includes providing a first electronic component having a first and second reference pins. A second electronic component having a third and fourth reference pins is also provided. A first input voltage is applied to the first reference pin. A bias resistor connected between the third reference pin and ground is provided, with the third reference pin serving as an output for providing a first reference voltage. The first reference voltage is measured. Bonding resistance between the first reference pin and the third reference pin is evaluated according to the measured first reference voltage.