Invention Grant
US07755447B2 Multilayer balun, hybrid integrated circuit module, and multilayer substrate
失效
多层平衡 - 不平衡转换器，混合集成电路模块和多层基板
- Patent Title: Multilayer balun, hybrid integrated circuit module, and multilayer substrate
- Patent Title (中): 多层平衡 - 不平衡转换器，混合集成电路模块和多层基板
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Application No.: US11948878Application Date: 2007-11-30
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Publication No.: US07755447B2Publication Date: 2010-07-13
- Inventor: Shimpei Oshima
- Applicant: Shimpei Oshima
- Applicant Address: JP
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP
- Agency: Chen Yoshimura LLP
- Priority: JP2006-331677 20061208
- Main IPC: H03H7/42
- IPC: H03H7/42 ; H01P3/08
Abstract:
A multilayer balun comprises first and second transmission lines that constitute a half-wave transmission line are opposed in adjacent layers, with a dielectric substance therebetween, so that, during use, the current of the first transmission line and the current of the second transmission line flow in the same direction. Thus, magnetic shield is formed between the first and second transmission lines. This eliminates the need for a grounding electrode layer for preventing magnetic interference between the first and second transmission lines.
Public/Granted literature
- US20080258838A1 MULTILAYER BALUN, HYBRID INTEGRATED CIRCUIT MODULE, AND MULTILAYER SUBSTRATE Public/Granted day:2008-10-23
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