Invention Grant
US07755449B2 Printed circuit board having impedance-matched strip transmission line
有权
具有阻抗匹配条形传输线的印刷电路板
- Patent Title: Printed circuit board having impedance-matched strip transmission line
- Patent Title (中): 具有阻抗匹配条形传输线的印刷电路板
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Application No.: US12217315Application Date: 2008-07-03
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Publication No.: US07755449B2Publication Date: 2010-07-13
- Inventor: Ki-Jae Song
- Applicant: Ki-Jae Song
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello, LLP
- Priority: KR10-2007-0067749 20070705
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H03H7/38

Abstract:
A printed circuit board (PCB) including an impedance-matched strip transmission line includes a strip transmission line including a main line and at least one pair of branch lines branching off from the main line. An upper ground layer is disposed over the strip transmission line and has upper opening parts corresponding in position to the branch lines. A lower ground layer is disposed under the strip transmission line and has lower opening parts corresponding in position to the branch lines. The upper and lower opening parts are symmetric about the branch lines of the strip transmission line.
Public/Granted literature
- US20090009261A1 Printed circuit board having impedance-matched strip transmission line Public/Granted day:2009-01-08
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