Invention Grant
US07755549B2 Carrier with solid antenna structure and manufacturing method thereof
有权
具有固体天线结构的载体及其制造方法
- Patent Title: Carrier with solid antenna structure and manufacturing method thereof
- Patent Title (中): 具有固体天线结构的载体及其制造方法
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Application No.: US11943595Application Date: 2007-11-21
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Publication No.: US07755549B2Publication Date: 2010-07-13
- Inventor: Hung-Hsiang Cheng
- Applicant: Hung-Hsiang Cheng
- Applicant Address: TW Nantze Export Processing Zone, Kao-Hsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Nantze Export Processing Zone, Kao-Hsiung
- Agent Winston Hsu
- Priority: TW95149876A 20061229
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
Carrier with solid antenna structure comprises a substrate and at least one solid antenna structure. The substrate has an upper surface, a lower surface, at least one first slot communicating with the upper surface and the lower surface and at least one second slot communicating with the upper surface and the lower surface. The solid antenna structure has a dielectric block formed between the first slot and the second slot and a radiation conductor, in which the dielectric block encloses the radiation conductor. In this invention, the solid antenna structure is used to enable the carrier to be applied to higher power transmission. Additionally, by setting the material of the dielectric block and optimizing the size of the radiation conductor, the carrier can be applied to multi-band.
Public/Granted literature
- US20080158080A1 CARRIER WITH SOLID ANTENNA STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2008-07-03
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