Invention Grant
- Patent Title: Inspection system and inspection method
- Patent Title (中): 检验制度和检验方法
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Application No.: US11703154Application Date: 2007-02-07
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Publication No.: US07755776B2Publication Date: 2010-07-13
- Inventor: Hiroshi Makino , Masaki Hasegawa , Momoyo Enyama
- Applicant: Hiroshi Makino , Masaki Hasegawa , Momoyo Enyama
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Stites & Harbison PLLC
- Agent Juan Carlos A. Marquez, Esq.
- Priority: JP2006-050853 20060227
- Main IPC: G01B11/28
- IPC: G01B11/28

Abstract:
There is a need for inspecting a heightwise variation in a sample. A holder holds a sample. A charge control unit charges the sample held by the holder. A retarding power supply applies a voltage to the sample held by the holder. An electro-optic system radiates an electron beam to the sample applied with a voltage by the retarding power supply and images a mirror electron returning near the surface of the sample. An image processing unit processes a mirror image resulting from imaging the mirror electron. The image processing unit outputs information corresponding to a difference between mirror images, i.e., a mirror image acquired by imaging the mirror electron and a mirror image for a prepared standard preparation, as a heightwise variation in a sample.
Public/Granted literature
- US20080073533A1 Inspection system and inspection method Public/Granted day:2008-03-27
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