Invention Grant
- Patent Title: Housing for electronic device and method of making the same
- Patent Title (中): 电子设备外壳及其制作方法
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Application No.: US11933965Application Date: 2007-11-01
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Publication No.: US07755880B2Publication Date: 2010-07-13
- Inventor: Chun-Bao Wang , Jie Tang , Jin-Lin Qiu
- Applicant: Chun-Bao Wang , Jie Tang , Jin-Lin Qiu
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agent Jeffrey T. Knapp
- Priority: CN200710074805 20070601
- Main IPC: G06F1/16
- IPC: G06F1/16
Abstract:
A housing (100) for an electronic device includes an opaque base (10). The base has a plurality of blind holes (120) and a number of through holes (140) defined therein. Each through hole communicates with a corresponding blind hole. The through holes are arrayed in a determined pattern.
Public/Granted literature
- US20080297989A1 HOUSING FOR ELECTRONIC DEVICE AND METHOD OF MAKING THE SAME Public/Granted day:2008-12-04
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