Invention Grant
- Patent Title: Housing assembly and method of assembling the assembly
- Patent Title (中): 外壳组装及组装方法
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Application No.: US11309407Application Date: 2006-08-04
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Publication No.: US07755882B2Publication Date: 2010-07-13
- Inventor: Shi-Kun Guo
- Applicant: Shi-Kun Guo
- Applicant Address: unknown Longhua Town, Bao'an District, Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: unknown Longhua Town, Bao'an District, Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Winston Hsu
- Main IPC: G06F1/16
- IPC: G06F1/16
Abstract:
A housing assembly includes a base body. The base body includes a plate having a mounting side, and a cover member. An opening is defined in the plate, the opening has a first end portion adjacent to the mounting side and an opposite second end portion communicating with the first end portion. The cover member is inserted into and partially shields the opening, the first end portion and a side of the cover member at the first end portion cooperatively define a fixing hole for allowing a hinge module to extend therethrough.
Public/Granted literature
- US20080040884A1 HOUSING ASSEMBLY AND METHOD OF ASSEMBLING THE ASSEMBLY Public/Granted day:2008-02-21
Information query
