Invention Grant
- Patent Title: Mounting apparatus for electronic device
- Patent Title (中): 电子设备安装装置
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Application No.: US11938303Application Date: 2007-11-12
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Publication No.: US07755888B2Publication Date: 2010-07-13
- Inventor: Zheng-Heng Sun
- Applicant: Zheng-Heng Sun
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200610201328 20061219
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
An exemplary mounting apparatus for an electronic device includes a base, a cover covering the base, and an ejection mechanism. The base includes a first receptacle portion for receiving the electronic device, and a second receptacle portion for receiving the ejection mechanism. The ejection mechanism includes a retaining member having a resilient tab slantingly extending therefrom, a button member, and a push member. The push member is slidably attached in the second receptacle portion and includes a push block movably abutting the electronic device, and a protrusion detachably engaging with the resilient tab. The button is moved to disengage the push member from the retaining member so that the push member pushes the electronic device out of the base.
Public/Granted literature
- US20080144259A1 MOUNTING APPARATUS FOR ELECTRONIC DEVICE Public/Granted day:2008-06-19
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