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Invention Grant
US07755895B2 Heat sink, an electronic component package, and a method of manufacturing a heat sink 有权
散热器，电子部件封装以及散热器的制造方法

  • Patent Title: Heat sink, an electronic component package, and a method of manufacturing a heat sink
  • Patent Title (中): 散热器，电子部件封装以及散热器的制造方法
  • Application No.: US11356129
    Application Date: 2006-02-17
  • Publication No.: US07755895B2
    Publication Date: 2010-07-13
  • Inventor: Hironobu Ikeda
  • Applicant: Hironobu Ikeda
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: McGinn IB Law Group, PLLC
  • Priority: JP2005-045398 20050222
  • Main IPC: H05K7/20
  • IPC: H05K7/20
Heat sink, an electronic component package, and a method of manufacturing a heat sink
Abstract:
A heat sink for an electronic component includes a structure that is bendable.
Abstract(Chinese):

用于电子部件的散热器包括可弯曲的结构。

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