Invention Grant
- Patent Title: Capacitor built-in interposer and method of manufacturing the same and electronic component device
- Patent Title (中): 电容器内置插入器及其制造方法和电子元器件
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Application No.: US11882646Application Date: 2007-08-03
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Publication No.: US07755910B2Publication Date: 2010-07-13
- Inventor: Naohiro Mashino
- Applicant: Naohiro Mashino
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2006-214205 20060807
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
A capacitor built-in interposer of the present invention, includes a base resin layer, a capacitor first electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively whereby the projection portion on one surface side of the base resin layer serves as a connection portion, a capacitor dielectric layer for covering the projection portion of the first electrode on other surface side of the base resin layer, and a capacitor second electrode for covering the dielectric layer, wherein a plurality of capacitors each constructed by the first electrode, the dielectric layer, and the second electrode are arranged and aligned in a lateral direction in a state that the capacitors are passed through the base resin layer.
Public/Granted literature
- US20080030968A1 Capacitor built-in interposer and method of manufacturing the same and electronic component device Public/Granted day:2008-02-07
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