Invention Grant
- Patent Title: Printed wiring board
- Patent Title (中): 印刷电路板
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Application No.: US12081503Application Date: 2008-04-16
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Publication No.: US07755911B2Publication Date: 2010-07-13
- Inventor: Masaoki Yoshida , Takuya Nakayama , Koji Ueyama
- Applicant: Masaoki Yoshida , Takuya Nakayama , Koji Ueyama
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Angell Palmer & Dodge LLP
- Priority: JP2007-110356 20070419
- Main IPC: H01R9/00
- IPC: H01R9/00

Abstract:
A printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Because the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.
Public/Granted literature
- US20080310133A1 Printed wiring board Public/Granted day:2008-12-18
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