Invention Grant
- Patent Title: Encapsulating packets for network chip conduit port
- Patent Title (中): 封装网络芯片管道端口的数据包
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Application No.: US11088394Application Date: 2005-03-23
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Publication No.: US07756124B2Publication Date: 2010-07-13
- Inventor: Bruce E. LaVigne , John A. Wickeraad , Lewis S. Kootstra , Jonathan M. Watts
- Applicant: Bruce E. LaVigne , John A. Wickeraad , Lewis S. Kootstra , Jonathan M. Watts
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H04L12/50
- IPC: H04L12/50 ; H04Q11/00 ; H04L12/28 ; H04J1/02
Abstract:
Systems, methods, and devices are provided for moving packets on a network device. One method includes receiving packets to a number of network chips, the number of network chips having a conduit port which can be selectively chosen to exchange packets with a processor responsible for processing packets. The method includes adding data for additional functionality to certain packets. Adding data includes encapsulating the certain packets to maintain an appearance of a certain packet format.
Public/Granted literature
- US20060215653A1 Encapsulating packets for network chip conduit port Public/Granted day:2006-09-28
Information query
