Invention Grant
- Patent Title: Implantable temperature sensor
- Patent Title (中): 可植入温度传感器
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Application No.: US10781245Application Date: 2004-02-18
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Publication No.: US07756581B2Publication Date: 2010-07-13
- Inventor: Rogier Receveur , Vincent Larik
- Applicant: Rogier Receveur , Vincent Larik
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Stephen W. Bauer; Michael J. Ostrom
- Main IPC: A61N1/00
- IPC: A61N1/00
Abstract:
A sensor is disposed within a pin portion of a feedthrough assembly. The feedthrough assembly provides a hermetically sealed enclosure that protects the sensor. In one embodiment, the sensor is a temperature sensor and the feedthrough assembly thermally isolates the sensor from the surrounding housing or enclosure.
Public/Granted literature
- US20050182452A1 Implantable temperature sensor Public/Granted day:2005-08-18
Information query
