Invention Grant
- Patent Title: Measuring device for measuring aspects of objects
- Patent Title (中): 用于测量物体方面的测量装置
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Application No.: US11966964Application Date: 2007-12-28
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Publication No.: US07756673B2Publication Date: 2010-07-13
- Inventor: Qing Liu , Jun-Qi Li
- Applicant: Qing Liu , Jun-Qi Li
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200710201272 20070803
- Main IPC: G01B3/22
- IPC: G01B3/22

Abstract:
An exemplary measuring device (100) for measuring aspects of objects includes a first contour measuring probe (10), a second contour measuring probe (20) and a processor (30). The first contour measuring probe (10) has a first tip extension (16) and a first displacement sensor (19). The first tip extension (16) is slidable in a first direction. The first displacement sensor (19) is used to sense a displacement of the first tip extension (16). The second contour measuring probe (20) has a second tip extension (26) and a second displacement sensor. The second tip extension (26) is slidable in the first direction. The second displacement sensor is used to sense a displacement of the second tip extension (26). The processor (30) is electrically connected to the first displacement sensor (19) and the second displacement sensor respectively.
Public/Granted literature
- US20090037141A1 MEASURING DEVICE FOR MEASURING ASPECTS OF OBJECTS Public/Granted day:2009-02-05
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