Invention Grant
- Patent Title: Architecture for business process integration
- Patent Title (中): 业务流程整合架构
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Application No.: US10715255Application Date: 2003-11-17
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Publication No.: US07756751B2Publication Date: 2010-07-13
- Inventor: Tsz Simon Cheng , Ying Huang , Santhosh Kumaran , Amaresh Rajasekharan , Mathews Thomas , Frederick Y. Wu , Yiming Ye
- Applicant: Tsz Simon Cheng , Ying Huang , Santhosh Kumaran , Amaresh Rajasekharan , Mathews Thomas , Frederick Y. Wu , Yiming Ye
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Novak Druce + Quigg
- Main IPC: G06Q30/00
- IPC: G06Q30/00

Abstract:
A software architecture can include an artifact layer and a configuration layer. The artifact layer can contain multiple application independent artifacts. A configuration layer can contain at least one application. The application can include multiple states in which the application executes instructions. The states can exist within execution spaces that are distributed across a network. The application uses artifacts of the artifact layer, which can operate in a state dependent manner.
Public/Granted literature
- US20050108680A1 Architecture for business process integration Public/Granted day:2005-05-19
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