Invention Grant
- Patent Title: Method and apparatus for machining deep hole
- Patent Title (中): 深孔加工方法及装置
-
Application No.: US12039074Application Date: 2008-02-28
-
Publication No.: US07771145B2Publication Date: 2010-08-10
- Inventor: Kouichi Katoh , Takamasa Itoh
- Applicant: Kouichi Katoh , Takamasa Itoh
- Applicant Address: JP Tokyo
- Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP (US)
- Priority: JP2007-051614 20070301
- Main IPC: B23B35/00
- IPC: B23B35/00 ; B23B41/02

Abstract:
There is provided a method for machining a deep hole, which enables prevention of scattering of a coolant and efficient discharge of shavings.The deep hole machining method includes: feeding a spindle to a deep hole machining start position while jetting a coolant toward a workpiece from an external normal pressure coolant supply line; closing the external normal pressure coolant supply line and opening a spindle normal pressure coolant supply line at the start of machining of a deep hole, and machining the deep hole to a predetermined intermediate depth while supplying a coolant to a machining point; and closing the spindle normal pressure coolant supply line and opening a high-pressure coolant supply line when the depth of the hole machined has reached the intermediate depth, and machining the deep hole to the final depth while supplying a high-pressure coolant to a machining point.
Public/Granted literature
- US20080213056A1 METHOD AND APPARATUS FOR MACHINING DEEP HOLE Public/Granted day:2008-09-04
Information query