Invention Grant
US07771184B2 Press with plate-like frame parts, and method for operating such a plate press 有权
按板状框架部件按压,以及操作这种印版机的方法

Press with plate-like frame parts, and method for operating such a plate press
Abstract:
The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mold parts (5,6), feed means for encapsulating material, and a drive mechanism connecting onto the mold parts. In a first embodiment the drive mechanism is provided with a fluid bed (14) and a first fluid feed (15) whereby their connection can be interrupted by a displacer (16). In a further embodiment a displacer (28) is provided in the feed channel (26) to place the encapsulating material (25) under pressure. Furthermore, the present invention relates to methods for encapsulating electronic components with encapsulating material in such presses.
Information query
Patent Agency Ranking
0/0