Invention Grant
- Patent Title: Apparatus for crumpling paper substrates
- Patent Title (中): 用于弄皱纸基板的装置
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Application No.: US12008166Application Date: 2008-01-09
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Publication No.: US07771338B2Publication Date: 2010-08-10
- Inventor: Thomas Wetsch , Robert Tegel
- Applicant: Thomas Wetsch , Robert Tegel
- Applicant Address: US IL Deerfield
- Assignee: Pregis Innovative Packaging, Inc.
- Current Assignee: Pregis Innovative Packaging, Inc.
- Current Assignee Address: US IL Deerfield
- Agency: Dorsey & Whitney LLP
- Main IPC: B31B1/00
- IPC: B31B1/00

Abstract:
The present subject matter relates generally to an apparatus for crumpling paper substrates. Specifically, the system provides for the crumpling of paper substrates to form fill material to be utilized in product packaging to fill void space and/or to wrap around products thereby allowing for safe transport of the products. The apparatus includes a feeder for feeding sheeting material, a first roller connected to a drive mechanism, a second roller disposed adjacent said first roller wherein said sheeting material travels between the first roller and the second roller and further wherein the second roller pushes said sheeting material against said first roller to engage the sheeting material with the first roller, and a third roller connected to the drive mechanism for directing said sheeting material out of said apparatus.
Public/Granted literature
- US20080207421A1 System and method for crumpling paper substrates Public/Granted day:2008-08-28
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