Invention Grant
US07771538B2 Substrate supporting means having wire and apparatus using the same
有权
具有导线的基板支撑装置和使用该支撑装置的装置
- Patent Title: Substrate supporting means having wire and apparatus using the same
- Patent Title (中): 具有导线的基板支撑装置和使用该支撑装置的装置
-
Application No.: US11039505Application Date: 2005-01-19
-
Publication No.: US07771538B2Publication Date: 2010-08-10
- Inventor: Chul-Joo Hwang , Sang-Do Lee
- Applicant: Chul-Joo Hwang , Sang-Do Lee
- Applicant Address: KR Gwangju-si, Gyeonggi-do
- Assignee: Jusung Engineering Co., Ltd.
- Current Assignee: Jusung Engineering Co., Ltd.
- Current Assignee Address: KR Gwangju-si, Gyeonggi-do
- Agency: Portland IP Law LLC
- Priority: KR10-2004-0004294 20040120; KR10-2004-0022648 20040401; KR10-2005-0001505 20050107
- Main IPC: C23C16/00
- IPC: C23C16/00
Abstract:
An apparatus includes: a process chamber for treating a substrate; a susceptor in the process chamber; a supporting frame over the susceptor; and at least one wire connected to the supporting frame.
Public/Granted literature
- US20050155557A1 Substrate supporting means having wire and apparatus using the same Public/Granted day:2005-07-21
Information query
IPC分类:
