Invention Grant
- Patent Title: Processing apparatus
- Patent Title (中): 处理装置
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Application No.: US11970759Application Date: 2008-01-08
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Publication No.: US07771553B2Publication Date: 2010-08-10
- Inventor: Paul J. Lemens , Christopher A. Holman , Adam J. Becker , Andrew Goodfellow
- Applicant: Paul J. Lemens , Christopher A. Holman , Adam J. Becker , Andrew Goodfellow
- Applicant Address: US NY Melville
- Assignee: Esselte Corporation
- Current Assignee: Esselte Corporation
- Current Assignee Address: US NY Melville
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: B32B37/00
- IPC: B32B37/00
Abstract:
The present invention relates to a processing apparatus, such as a laminator, for performing operations involving effecting adhesive bonding on substrates.
Public/Granted literature
- US20080099123A1 PROCESSING APPARATUS Public/Granted day:2008-05-01
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