Invention Grant
US07771560B2 Methods to prevent ECC (edge chipping and cracking) damage during die picking process
失效
在拣货过程中防止ECC（边缘切屑和开裂）损坏的方法
- Patent Title: Methods to prevent ECC (edge chipping and cracking) damage during die picking process
- Patent Title (中): 在拣货过程中防止ECC（边缘切屑和开裂）损坏的方法
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Application No.: US11863356Application Date: 2007-09-28
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Publication No.: US07771560B2Publication Date: 2010-08-10
- Inventor: James R. Johnson , Timothy C. Krywanczyk , Matthew R. Whalen
- Applicant: James R. Johnson , Timothy C. Krywanczyk , Matthew R. Whalen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent William H. Steinberg, Esq.
- Main IPC: B32B38/10
- IPC: B32B38/10
Abstract:
A method for preventing edge chipping and cracking damage encountered by semiconductor chips in a die picking operation during separation from an adhesive sheet. Also provided is a device for preventing potential edge chipping and cracking damage encountered by a semiconductor chip during die picking processes.
Public/Granted literature
- US20090084499A1 METHODS TO PREVENT ECC (EDGE CHIPPING AND CRACKING) DAMAGE DURING DIE PICKING PROCESS Public/Granted day:2009-04-02
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