Invention Grant
- Patent Title: Mold and method for forming products
- Patent Title (中): 模具和成型方法
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Application No.: US11794463Application Date: 2005-12-23
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Publication No.: US07771645B2Publication Date: 2010-08-10
- Inventor: Hendricus Antonius Hoogland
- Applicant: Hendricus Antonius Hoogland
- Applicant Address: NL Ijssel
- Assignee: ECIM Technologies B.V.
- Current Assignee: ECIM Technologies B.V.
- Current Assignee Address: NL Ijssel
- Agency: Hoffmann & Baron, LLP
- Priority: NL1027912 20041228
- International Application: PCT/NL2005/000888 WO 20051223
- International Announcement: WO2006/071111 WO 20060706
- Main IPC: B29C45/56
- IPC: B29C45/56

Abstract:
Mold (20), provided with a mold cavity which is at least partly defined by a movable wall part (50), wherein injection means (34) are provided for introducing material into the mold cavity, which injection means comprise at least one injection opening (34A) which is provided in at least one stationary wall part (80) of the mold cavity, wherein said stationary wall part (80) is at least partly surrounded by said at least one movable wall part (50).
Public/Granted literature
- US20080116613A1 Mold and Method for Forming Products Public/Granted day:2008-05-22
Information query
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