Invention Grant
- Patent Title: Electric microcontact printing method and apparatus
- Patent Title (中): 电微接触印刷方法和装置
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Application No.: US10316997Application Date: 2002-12-11
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Publication No.: US07771647B2Publication Date: 2010-08-10
- Inventor: Heiko O. Jacobs , George M. Whitesides
- Applicant: Heiko O. Jacobs , George M. Whitesides
- Applicant Address: US MA Cambridge
- Assignee: President and Fellows of Harvard College
- Current Assignee: President and Fellows of Harvard College
- Current Assignee Address: US MA Cambridge
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H05B6/54
- IPC: H05B6/54 ; G11C11/23 ; B41J2/385
Abstract:
A method and apparatus for providing electric microcontact printing is provided. A stamp is brought into contact with the surface of a substrate to provide high resolution features. Aspects of the invention may be used for data storage, microcontact printing, and for other applications requiring high resolution pattern transfer.
Public/Granted literature
- US20030178316A1 Electric microcontact printing method and apparatus Public/Granted day:2003-09-25
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