Invention Grant
- Patent Title: Material and uses thereof
- Patent Title (中): 其材料及用途
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Application No.: US11338351Application Date: 2006-01-24
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Publication No.: US07771650B2Publication Date: 2010-08-10
- Inventor: Wei Beng Ng , Akio Takada
- Applicant: Wei Beng Ng , Akio Takada
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Frommer Lawrence & Haug LLP
- Agent William S. Frommer; Thomas F. Presson
- Priority: SG200500445-2 20050125
- Main IPC: C22C19/07
- IPC: C22C19/07
Abstract:
A material comprising cobalt (Co), platinum (Pt) and phosphorus (P) having a composition of 94-98 wt % Co, 0-1 wt % Pt and 2-4 wt % P. The material may be subjected to annealing at a temperature between 100 and 500 degrees Celsius. The material is formed by electroplating a substrate in a suitable electrochemical bath. The electroplated CoPtP material forms a layer on the substrate. The CoPtP material has enhanced perpendicular magnetic properties and may be advantageous for use in microelectromechanical system (MEMS) devices.
Public/Granted literature
- US20060180884A1 Material and uses thereof Public/Granted day:2006-08-17
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