Invention Grant
- Patent Title: Conductive material comprising an Me-DLC hard material coating
- Patent Title (中): 包含Me-DLC硬质材料涂层的导电材料
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Application No.: US11571771Application Date: 2005-06-15
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Publication No.: US07771822B2Publication Date: 2010-08-10
- Inventor: Thomas Jabs , Michael Scharf , Martin Grischke , Orlaw Massler
- Applicant: Thomas Jabs , Michael Scharf , Martin Grischke , Orlaw Massler
- Applicant Address: CH Trubbach DE Ulm
- Assignee: Oerlikon Trading AG, Trubbach,Wieland-Werke Ltd.
- Current Assignee: Oerlikon Trading AG, Trubbach,Wieland-Werke Ltd.
- Current Assignee Address: CH Trubbach DE Ulm
- Agency: Pearne & Gordon LLP
- Priority: CH1166/04 20040709
- International Application: PCT/CH2005/000333 WO 20050615
- International Announcement: WO2006/005200 WO 20060119
- Main IPC: B32B9/00
- IPC: B32B9/00

Abstract:
The invention relates to a conductive material consisting of an alloy that contains copper, for use as a plug-in or clip connection. Said material comprises a cover layer that is deposited on at least some sections of the contact surface, said layer consisting at least of a support layer and an adhesive layer. The anti-friction layer has a carbon content greater or less than 40 and less than or equal to 70 atomic percent.
Public/Granted literature
- US20080075625A1 Conductive Material Comprising an Me-Dlc Hard Material Coating Public/Granted day:2008-03-27
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