Invention Grant
- Patent Title: Resist composition and patterning process using the same
- Patent Title (中): 抗蚀剂组成和图案化工艺使用相同
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Application No.: US11730289Application Date: 2007-03-30
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Publication No.: US07771913B2Publication Date: 2010-08-10
- Inventor: Tatsushi Kaneko , Jun Hatakeyama , Yuji Harada
- Applicant: Tatsushi Kaneko , Jun Hatakeyama , Yuji Harada
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-103016 20060404
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/038 ; G03F7/20 ; G03F7/30

Abstract:
There is disclosed a resist composition comprising, at least, a polymer including repeating units represented by the following general formula (1). There can be provided a resist composition that has a good barrier property against water, prevents resist components from leaching to water, has high receding contact angle against water, does not require a protective film, has an excellent process applicability, suitable for the liquid immersion lithography and makes it possible to form micropatterns with high precision.
Public/Granted literature
- US20070231738A1 Resist composition and patterning process using the same Public/Granted day:2007-10-04
Information query
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