One aspect of the invention provides a method of manufacturing a FeRAM semiconductor device having reduce single bit fails. This aspect includes forming an electrical contact within a dielectric layer located over a semiconductor substrate and forming a first barrier layer over the dielectric layer and the electrical contact. The first barrier layer is formed by depositing multiple barrier layers and densifying each of the barrier layers after its deposition. This forms a stack of multiple barrier layers of a same elemental composition. The method further includes forming a second barrier layer over the first barrier layer and forming a lower capacitor electrode, a ferroelectric dielectric layer over the lower capacitor, and forming an upper capacitor electrode over the ferroelectric dielectric layer. A device made by this method is also provided herein.