Invention Grant
US07772033B2 Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making same
有权
具有嵌入到封装半导体管芯的模具中的具有不同导电特征的半导体器件及其制造方法
- Patent Title: Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making same
- Patent Title (中): 具有嵌入到封装半导体管芯的模具中的具有不同导电特征的半导体器件及其制造方法
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Application No.: US11864433Application Date: 2007-09-28
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Publication No.: US07772033B2Publication Date: 2010-08-10
- Inventor: Juergen Simon , Laurence Edward Singleton
- Applicant: Juergen Simon , Laurence Edward Singleton
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method for making a semiconductor device includes creating conductive structures on a substrate. Contact pads of a semiconductor die are connected to first ends of conductive structures. The semiconductor die is encapsulated or embedded and the substrate is removed such that second ends of the conductive structures are exposed to the exterior.
Public/Granted literature
- US20090085190A1 Semiconductor Device and Method for Making Same Public/Granted day:2009-04-02
Information query
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