Invention Grant
US07772039B2 Procedure for arranging chips of a first substrate on a second substrate
有权
将第一衬底的芯片布置在第二衬底上的步骤
- Patent Title: Procedure for arranging chips of a first substrate on a second substrate
- Patent Title (中): 将第一衬底的芯片布置在第二衬底上的步骤
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Application No.: US11144392Application Date: 2005-06-03
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Publication No.: US07772039B2Publication Date: 2010-08-10
- Inventor: Martin Kerber
- Applicant: Martin Kerber
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Brinks Hofer Gilson & Lione
- Priority: DE102004027489 20040604
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
The invention relates to a method for arranging chips of a first substrate on a second substrate, in which the chips are grouped at least into first chips and into second chips, the first chips of the first substrate are singulated and the singulated first chips are arranged on the second substrate in such a way that each of the first chips on the second substrate is unambiguously assigned to the associated first chip on the first substrate.
Public/Granted literature
- US20060014308A1 Procedure for arranging chips of a first substrate on a second substrate Public/Granted day:2006-01-19
Information query
IPC分类:
