Invention Grant
US07772040B2 Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
有权
半导体器件的制造方法，其中使用的粘合片以及由此获得的半导体器件
- Patent Title: Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
- Patent Title (中): 半导体器件的制造方法，其中使用的粘合片以及由此获得的半导体器件
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Application No.: US11853743Application Date: 2007-09-11
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Publication No.: US07772040B2Publication Date: 2010-08-10
- Inventor: Sadahito Misumi , Takeshi Matsumura , Kazuhito Hosokawa , Hiroyuki Kondo
- Applicant: Sadahito Misumi , Takeshi Matsumura , Kazuhito Hosokawa , Hiroyuki Kondo
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175° C. is 2000 Pa or more.
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